F&S BONDTEC Semiconductor GmbH
Braunau am Inn, Austria
About
F&S BONDTEC Semiconductor GmbH provides ultrasonic bonding solutions for battery-related applications.
Notably, the company offers ultrasonic battery bonding and ultrasonic contract bonding for battery modules, described as flexible and advantageous techniques for bonding battery cells in battery packs.
From the Battery Report
Battery Report 2025 · chapterSoftware / AIVolta Foundation's annual report on this part of the battery industry.Supply Chain Segments
Location Info
- HQ
- Braunau am Inn, Austria
Europe (1)
- Office
- Taubenbach, Germany
Quick Facts
- Founded
- 1994
- Team Size
- 11-50
- Funding
- Private
- Last Updated
- Oct 12, 2026
