NovoLINC

About

NovoLINC develops thermal interface materials that carry heat away from high-power electronic chips.

Its nanocomposite material reaches thermal resistance as low as 0.7 mm²K/W, is soft and compressible, can be reworked, and can bond two surfaces at room temperature. The company says the material has been cycled thousands of times at extreme temperatures without losing performance, and that it can be tailored in composition and size for different uses, with IP-protected, scalable manufacturing.

The 2025 Battery Report shows NovoLINC in the 'power & cooling infrastructure' layer of the AI energy stack on its data center page.